Particle Adhesion : Applications and Advances

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Particle Adhesion : Applications and Advances

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  • 製本 Hardcover:ハードカバー版／ページ数 493 p.
  • 言語 ENG
  • 商品コード 9789056997250
  • DDC分類 530.417

基本説明

From the use of single particles as probes of material properties to the finite element computation of interaction energetics, this book offers its readers a variety of perspectives on research in particle adhesion.

Full Description

Whenever a curved surface interacts with another surface, the principles of adhesion are at work. From the cells in your body to the dust on your glasses, intermolecular forces cause materials to attract one another. Elastic deformations resulting from these adhesive interactions store strain that can be liberated during particle detachment. Time dependent changes in adhesion can result from plastic deformation that both increases the real effective contact area and reduces the stored energy available to assist in particle removal.

Contents

Preface; Biological Applications of Particle Adhesion Concepts A Particle Adhesion Perspective on Metastasis; Adhesion of Cancer Cells to Endothelial Monolayers: A Study of Initial Attachment Versus Firm Adhesion; Cell-Cell Adhesion of Erythrocytes; Particle-induced Phagocytic Cell Responses Are Material Dependent: Foreign Body Giant Cells Vs. Osteoclasts from a Chick Chorioallantoic Membrane Particle-implantation Model; The Body's Response to Deliberate Implants: Phagocytic Cell Responses to Large Substrata Vs. Small Particles; The Body's Response to Inadvertent Implants: Respirable Particles in Lung Tissues; Elastic and Viscoelastic Contributions to Understanding Particle Adhesion; Measurement of the Adhesion of a Viscoelastic Sphere to a Flat Non-Compliant Substrate; Surface Forces and the Adhesive Contact of Axisymmetric Elastic Bodies; Finite Element Modeling of Particle Adhesion: A Surface Energy Formalism; Creep Effects in Nanometer-scale Contacts to Viscoelastic Materials: A Status Report; Particle Surface Interactions That Influence Adhesion; Experiments and Engineering Models of Microparticle Impact and Deposition; The Adhesion of Irregularly-shaped 8|im Diameter Particles to Substrates: The Contributions of Electrostatic and van der Waals Interactions; Electrical Conductivity Through Particles; Copper-based Conductive Polymers: A New Concept in Conductive Resins; Exploring Particle Adhesion with Single Particle Experiments; Interactions Between Micron-sized Glass Particles and Poly(dimethyl siloxane) in the Absence and Presence of Applied Load; Atomic Force Microscope Techniques for Adhesion Measurements; Limitation of the Young-Dupré Equation in the Analysis of Adhesion Forces Involving Surfactant Solutions; Mechanical Detachment of Nanometer Particles Strongly Adhering to a Substrate: An Application of Corrosive Tribology; Advances in Controlling the Attachment and Removal of Groups of Particles; The Effect of Relative Humidity on Particle Adhesion and Removal; The Effect of Time and Humidity on Particle Adhesion and Removal; Recent Theoretical Results for Nonequilibrium Deposition of Submicron Particles; Aerosol Particle Removal and Re-entrainment in Turbulent Channel Flows-A Direct Numerical Simulation Approach