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Full Description
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
Contents
1 Introduction.- 1.1 Numerical Modeling with Finite Element Analysis.- 1.2 Constitutive Relations.- 1.3 Failure Prediction.- 1.4 References.- 2 Thermomechanical Fatigue Life Prediction Analysis.- 2.1 Approach.- 2.2 Analysis Steps.- 2.3 Case Study: BGA-Type Package.- 2.4 References.- 3 Mechanical Bending Fatigue Life Prediction Analysis.- 3.1 Approach.- 3.2 Analysis Steps.- 3.3 Case Study: BGA-Type Package.- 3.4 References.- 4 Macro Reference Library.- 4.1 Overview.- 4.2 Preprocessor.- 4.3 Solution.- 4.4 Postprocessing.- 4.5 Reference.- Appendix A: Installation and Execution.- A.1 Steps for ReliANS Installation on a PC Platform.- A.2 Steps for Adding Working Directories for Use in ReliANS.- A.3 Demonstration of ReliANS Installation and Adding New Directories.- A.4 Installation of ReliANS on UNIX Systems.- Appendix B: Input Listings for Case Studies.- B. 1 Input Listing for the Case Study Given in Chapter 2.- B.2 Input Listing for the Case Study Given in Chapter 3.