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基本説明
The first handbook on the fabrication and design of hybrid microelectronic circuits covers a wide range of disciplines including material science, ceramic technology, and elctronic circuit engineering.
Full Description
This is the first handbook on the fabrication and design of hybrid microelectronic circuits.
* Deals with all aspects of the technology, design, layout and processing of materials.
* Fills the need for a comprehensive survey of a widely-used technology.
Contents
Preface. 1- Introduction.
2- Mathematical Foundations Circuit Design, and Layout Rules for Hybrid Microcircuits.
3- Computer-Aided Design and Pattern Generation Techniques.
4- Thick-Film Fundamentals.
5- Thick-Film Deposition Techniques.
6- Thin-Film Fundamentals.
7- Thin-Film Deposition Techniques.
8- Component Assembly and Interconnections.
9- Adjustment of Passive Components.
10- Packaging and Thermal Considerations.
11- Multichip Module and Microwave Hybrids Circuits.
Glossary.
Index.