- ホーム
- > 洋書
- > 英文書
- > Science / Mathematics
Full Description
Publisher's Noteguaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the productA rigorous and thorough introduction to electronic packaging technologiesThe only book to teach microsystems packaging--written by the field's leading authorThis is the book that engineers, technicians, and students want-the first to teach microsystems packaging from the ground up. Rao Tummala's one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It's the only book to do so. This much-needed tool features:*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.*Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology*Easy-to-read schematics and block diagrams*Fundamental approaches to all system issues*Examples of all common configurations and technologies-wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes*Basics of electrical and reliability testing*Hundreds of explanatory two-color illustrations*Self-test problems and solutions in every chapter*Glossary*The best way to learn microsystems packaging through self-study or in a classroom-and the most comprehensive on-the-job referenceMICROSystems PACKAGINGFROM THE GROUND UP
Contents
Chapter 1of Packaging in Microelectronics Chapter 3: The Role of Packaging in Microsystems. Chapter 4: Fundamentals of Electrical Package Design. Chapter 5: Fundamentals of Design for Reliability. Chapter 6: Fundamentals of Thermal Management. Chapter 7: Fundamentals of Single Chip Packaging. Chapter 8: Funamentals of Multichip Packaging. Chapter 9: Fundamentals of IC Assembly. Chapter 10: Fundamentals of Water-Level Packaging. Chapter 11: Fundamentals of Passives: Discrete, Integrated, and Embedded. Chapter 12: Fundamentals of Optoelectronics. Chapter 13: Fundamentals of RF Packaging. Chapter 14: Fundamentals of Microelectromechanical Systems. Chapter 15: Fundamentals of Sealing and Encapsulation. Chapter 16: Fundamentals of System-Level PWB Technologies. Chapter 17: Fundamentals of Board Assembly. Chapter 18: Fundamentals of Packaging Materials and Processes. Chapter 19: Fundamentals of Electrical Testing. Chapter 20: Fundamentals of Package Manufacturing. Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.NER(01): WOW
